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The aim of this research was to investigate formaldehyde content in and volatile organic compounds release from particleboards produced from fibrous chips. The object of the tests were panels produced from fibrous chips of black locust Robinia Pseudoacacia L. and willow Salix Viminalis L., as well as from typical industrial particles. The results show that formaldehyde content in the panels produced from willow fibrous chips is similar to the content in the panels made of industrial particles. The concentration of total volatile organic compounds measured after 4 weeks of storage is significantly lower than the required by the existing regulations.
This paper presents the preliminary research results of a project whose main objective is to quantify the impact of formulations and technological parameters on formaldehyde content in and emission from particleboards produced using urea-formaldehyde resin with a low molar ratio of F/U. The formaldehyde content reduction is possible by using a resin with a molar ratio of F/U of 1.065 hardened with 3% solution of urea and ammonium nitrate or a resin with a molar ratio of F/U of 0.96 to which 3% urea was added. For these variants, reductions by 22% and 21% respectively of formaldehyde content in particleboards were obtained, while at the same time, strength properties that meet the requirements of the EN-312: 2011 standard for P2 particleboards were maintained.
The aim of the study was to investigate the acetoacetylation of particles on the formaldehyde content and the physical and mechanical properties of particleboards, glued with the UF resin. The produced particleboards were subjected to the following tests: internal bond, modulus of rupture, modulus of elasticity, swelling in thickness after 24 hours of soaking in water, the content and the emission of formaldehyde. Results of the study make it possible to state that spreading ethyl acetoacetate on the particles before gluing, results in the decrease in the content as well as the emission of formaldehyde from particleboards, without causing essential changes in their physical and mechanical properties.
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