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2010 | 10D |
Tytuł artykułu

Electrochemical-mechanical running in of the main engine's conjugations

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Warianty tytułu
Ehlektrokhimiko-mekhanicheskaja prirabotka osnovnykh soprjazhenij dvigatelej
Języki publikacji
Opis fizyczny
  • Volodymyr Dahl East-Ukrainian University, Lugansk, Ukraine
  • 1. Semenov V., 1991.: Mode of lubricating of pair of friction piston ring-cylinder of engine // Engine construction.- No10-11,- p.19-23.
  • 2. Lyubimov V., Kitaev U., 1983.: Influence of anionic composition of electrolyte on leveler properties of electrochemical treatment with a periodic abrassive depassivation // Electronic treatment of materials.- N°5.- p.13-17.
  • 3. Kadaner L., Kotlyar A., Scherbak M. and other., 1971.: Method of research of anodal kinetics of dissolution of metals in the conditions of their abrasive destruction // Electronic treatment of materials.- No 1.- p.15-20.
  • 4. Economikos L., Wang X., Sakamoto A., and other., 2004.: Integrated Electro- Chemical Mechanical Planarization (Ecmp) for Future Generation Device Technology// IEEE, - p.233-235.
  • 5. Shuo-Jen Lee, Yu-Ming Lee, Ming-Feng Du. ,2003.: The polishing mechanism of electrochemical mechanical polishing technology // Journal of Materials Processing Technology, IEEE, V.140 -p.280- 286.
  • 6. Peter J. Blau, 2005.: On the nature of running- in // Tribology International, 38. - pp.1007-1012.
  • 7. Canhua Li, Ishwara B. Bhat, Rongjun Wang, Joseph Seiler, 2004.: Electro- Chemical Mechanical Polishing of Silicon Carbide // Journal of Electronic Materials, Vol.33, N°5,. - pp.481- 486.
  • 8. Yuan-Long Chen, Shu-Min Zhu, Shuo-Jen Lee and other, 2003.: The technology combined electrochemical mechanical polishing // Journal of Materials Processing Technology 140. - pp.203- 205.
  • 9. Alan S. Brown, 2005.: Flat, Cheap, and Under Control// IEEE Spectrum, -pp.40- 45.
  • 10. Milind Kulkami, Dedy Ng, Melloy Baker and other, 2007.: Electropotential- stimulated wear of copper during chemical mechanical planarization// Wear 263. - pp. 1470-1476.
  • 11. Samuel B. Emery, Jennifer L. Hubbley, Maria A. Darling and other, 2005.: Chemical factors for chemical- mechanical and electrochemical- mechanical planarization of silver examined using potentiodynamic and impedance measurements// Materials Chemistry and Physics 89. - pp.345- 353.
  • 12. Goonetilleke P.C., Roy D., 2005.: Electrochemical- mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes// Materials Chemistry and Physics 94. - pp.388- 400.
  • 13. Mellier M., Berger T., Duru R. and other, 2007.: Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32nm Nodes// IEEE. - pp.70-72.
  • 14. Guanghui Fu, Abhijit Chandra, Sumit Guha, Ghatu Subhash, 2001.: A Plasticity- Based Model of Material Removal in Chemical-Mechanical Polishing (CMP) // IEEE. - pp.406-417.
  • 15. Seok J., Sukam C.P., Borucki L. and other, 2003.: Developing the Structure of a Cu CMP Model// IEEE. - pp.303- 306.
  • 16. Okumu Ouma D., Duane S. Boning, James E. Chung and other, 2002.: Characterization and Modeling of Oxide Chemical-Mechanical Polishing Using Planarization Length and Pattern Density Concepts// IEEE. - pp.232- 244.
  • 17. Dick de Roover, Abbas Emami-Naeini, Jon L. Ebert, 2004.: Model - Based Control for Chemical-Mechanical Planarization (CMP) // AACC. - pp.3922-3929.
  • 18. Yung-Fu Wu, Tzu-Hsuan Tsai, 2007.: Effect of organic acids on copper chemical mechanical polishing. Microelectronic Engineering. - pp.1-9.
  • 19. Zamota T., Kravchenko A., 2010.: Improvement of tribotechnical characteristics of piston ring surfase at running in//TEKA, Commission of Motorization and Power Industry in Agriculture. - Vol. XB. -Lublin,-p. 323-330
  • 20. Zamota T., Zorin R., 2009.: Determination of output on a current at ECMR(G) of conjugation shaft and journal bearing at presence of macrogeometrical rejections // National interdepartmental scientific and technical collection. Constructing, production and exploitation of agricultural machines / KNTU, Vol. 40. - p.269-275.
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