Analysis of electroplated nickel coating thickness

• Autorzy: Gombar M. , Dobrovic J. , Kmec J. , Vagaska A. , Bicejova L.
• Języki publikacji: EN

Abstrakty

EN

The paper deals with analysis of the nickel coating thickness created by electrolytic nickel plating (also called galvanic nickel plating) using the Custom Design. As the basic type of electrolyte chloride electrolyte containing nickel chloride (NiCl2). was used. The effect of chemical factors was studied in an experimental procedure including: the amount of nickel chloride, boric acid, brightener additives Ni 1051, Ni 163, detergent Ni 165 and the effect of physical factors: the temperature of electrolyte, plating time and the total voltage at a constant current density of 1 A.dm2

• Wydawca: -
• Czasopismo: Intercathedra
• Rocznik: 2012
• Tom: 28
• Numer: 2
• Opis fizyczny: p.11-17,fig.,ref.

Twórcy

autor

Gombar M.

• FVT - Presov,TU - Kosice, Bajerova 1, Presov, Slovakia

autor

Dobrovic J.

• Fakulta manazmentu, PU - Presov, Konstantínova 3,Presov, Slovakia

autor

Kmec J.

• Fakulta manazmentu, PU - Presov, Konstantínova 3,Presov, Slovakia

autor

Vagaska A.

• FVT - Presov,TU - Kosice, Bajerova 1, Presov, Slovakia

autor

Bicejova L.

• FVT - Presov,TU - Kosice, Bajerova 1, Presov, Slovakia

Bibliografia

• [1] Boldt J.S. Jr: The Winning of Nickel. Methuen, London, 1967.
• [2] Gilroy D.:, The electrowinning of metals. In: A.T. Kuhn (Ed.), Industrial Electrochemical Processes. Elsevier, Amsterdam, 1971, pp. 175–217.
• [3] Wu R., Oliazadeh M., Alfantazi A.M., Appl J.: Electrochem. 33 (2003)1043–1047.
• [4] Walker R., Sandford A.R.B.: Chem. Ind. 19 (1979) 642–647.
• [5] Kumar V., Pandey B.D., Akkerkar D.D.: Hydrometallurgy 24 (1990)189–201.
• [6] Ebrahimi F., Bourne G.R., Kelly M.S., Matthews T.E.: Nanostruct. Mater.11 (1999) 343–350.
• [7] Ebrahimi F., Ahmed Z., Appl J.: Electrochem. 33 (2003) 733–739.
• [8] Oniciu L., Muresan L., Appl J.: Electrochem. 21 (1991) 565.
• [9] Dennis J.K., Fuggle J.J.: Electroplat. Met. Finish. 17 (Jan 1968).
• [10] Wang J., Zhao X., Pan J., Yin X.: Mater. Sci. Eng. 18 (2000) 70–74.
• [11] Biswas K., Davenport W.G.: Extraction metallurgy of copper, 3rd Edition, Pergamon Press, UK, 1994.
• [12] Kumar V., Pandey B.D., Akerkar D.D.: Electrowinning of nickel in the processing of polymetallicseanodules, Hydrometallurgy 24 (1990) 189–201.
• [13] Pandey B.D., Kumar V.: Extraction of copper and nickel from ammoniacalleachliquorsofIndianseanodules, Hydrometallurgy 26 (1991) 35–45.
• [14] Agrawal A., Kumari S., Manoj M.K., Pandey B.D., Kumar Bagchi V., Premchand D. in: V.N. Mishra, S.C. Das, K.S. Rao (Eds.), Proceedings of Int. Symp. on Solv. Extr., Bhubaneswar, Allied Publishers Pvt. Ltd., 2002, pp. 34–42.
• [15] Ji J., Cooper W.C., Dreisinger D.B., Peters E., Appl J.: Electrochem. 25(1995) 642.
• [16] KuÈzeci E., Kammel R., Gogia S.K., Appl J.. Electrochem. 24 (1994) 730.
• [17] Rambla J., Brillasi E., Casado J., Nickelelectrowinningusing a Ptcatalysedhydrogen-diffusionanode, Part II: batch tank with a sulphatebath, J. Appl. Electrochem. 29 (1999) 1211–1216.
• [18] Fornari P., Abbruzzese C., Copper and nickel selective recovery by electrowinning from electronic and galvanic industrial solutions, Hydrometallurgy 52 (1999) 209–222.