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2014 | 23 | 6 |
Tytuł artykułu

Metals content in printed circuit board waste

Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This paper an presents analysis of metals in waste of printed circuit boards (PCB) covering types of PCB, segregated from PC computers, mobile phones, and mixed. The presented data identifies metals and other substances found in PCB waste based on elemental and technical analysis of PCBs. PCB categorization based on gold concentration is presented, resulting in two groups: electric and electronic PCBs. Then mass of PCBs in waste of electric and electronic equipment (WEEE) is presented, and annual PCB mass is calculated for collection in Polish WEEE. Finally, I present an analysis of metals values in PCBs pointing to gold, palladium, and copper as the three the most valuable metals for recovery. This study presents an overview of resources present in printed circuit boards.
Słowa kluczowe
Wydawca
-
Rocznik
Tom
23
Numer
6
Opis fizyczny
p.2365-2369,fig.,ref.
Twórcy
  • Industrial Research Institute for Automation and Measurements, Aleje Jerozolimskie 202, 02-486 Warsaw, Poland
Bibliografia
  • 1. HUISMAN J. Review of Directive 2002/96 on WEEE, Final Report, United Nations University, 2007.
  • 2. COBBING M. Toxic Tech: Not In Our Backyard, Greenpeace.org, 2008.
  • 3. NI M., XIAO H., CHI Y., YAN J., BUEKENS A., JIN Y., LU S. Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace. Waste Manage. 32, 568, 2012.
  • 4. SOHAILI J., MUNIYANDI S., MOHAMAD S. A Review on Potential Reuse of Recovered Nonmetallic Printed Circuit Board Waste, Journal of Emerging Trends in Engineering and Applied Sciences (JETEAS) 2, (6), 946, 2011.
  • 5. Main Inspector of Environment Protection WEEE report, www.gios.gov.pl, 2011.
  • 6. SZAŁATKIEWICZ J., SZEWCZYK R., BUDNY E., MISSALA T., WINIARSKI W. Construction aspects of plasma based technology for waste of electrical and elec­tronic equipment (WEEE) management in urban areas. Procedia Engineering, 57C, 1100, 2013.
  • 7. Recycling - From E-Waste to Resources, Final report 2009, UN Environment Programme www.unep.org.
  • 8. SKRZYPEK S., PRZYBYŁOWICZ K. Inżynieria metali i ich stopów, Akademia Górnoczo-Hutnicza, Kraków, 2012.
  • 9. Restriction of Hazardous Substances (2002/95/EC), z 27 January 2003, came to force 1 July 2006. http://www.rohs- weee.pl/rohs.php; http://www.gios.gov.pl/artykuly/169/ROHS
  • 10. SEELING K., SURASKI D. A comparison of tin-silver-cop­per lead-free solder alloys, AIM Incorporated, www.aimsolder.com.
  • 11. HINO T., AGAWA R., MORIYA Y., NISHIDA M., TSUGI- TA Y., ARAKI T. Techniques to separate metal from waste printed circuit boards from discarded personal computers. Journal of Matter Cycles Waste Management, 11, 2009.
  • 12. HAGELUKEN C., MESKERS C. Mining our computers - Opportunities and Challenges to Recover Scarce and Valuable Metals from End-of Life Electronic Devices. Proceedings Electronics Goes Green 2008+, Fraunhofer IZM, Germany, 2008.
  • 13. Boliden mine, Sweden, http://www.mining-technolo- gy.com/projects/boliden/.
  • 14. Gold mine in Russia Ural, http://www.npo-cen- ter.com/en/technologies/zoloto_ruda/.
  • 15. SZEWCZYK R., SZALATKIEWICZ J., BUDNY E., MISSALA T., WINIARSKI W. Identification of specific characteristics of plasmatron powered plasma reactor. Pomiary Automatyka Robotyka, nr 11, 2012.
  • 16. ZHOU G., LUO Z., ZHAI X. Experimental Study on Metal Recycling from Waste PCB. Proceedings of the International Conference on Sustainable Solid Waste Management, Chennai, India. pp. 155-162, 2007.
  • 17. VASILE C., BREBU M. A., TOTOLIN M., YANIK J., KARAYILDIRIM T., DARIE H. Feedstock Recycling from the Printed Circuit Boards of Used Computers. Energ. Fuel., 22, (3), 1658, 2008.
  • 18. HAGELUKEN C. Metals Recovery from e-scrap in a glob­al environment. Technical capabilities, challenges & experi­ence gained. Umicore PMR, 6th session of OEWG Basel Convention Geneva, 2007.
  • 19. GOODSHIP V., STEVELS A. Editors, Waste Electrical and Electronic Equipment (WEEE) Handbook. Philips Woodheas Publishing, pp. 299-303, 2012.
  • 20. CUI J., FORSSBERG E. Mechanical recycling of waste electric and electronic equipment: a review, J. Hazard. Mater., 99, (3), 243, 2003.
  • 21. JIANJUN H., JIABIAO S., YUEDONG M., ZHENGZHI L. DC Arc Plasma Disposal of Printed Circuit Board, Plasma science & Technology, 6, (4), 2004.
  • 22. European Brominated Flam Retardant Industry Panel, TBBA http://www.ebfrip.org/main-nav/our-substances/tbbpa, accessed 2014-10-22.
  • 23. Umicore, Belgium process description, http://www.preciousmetals.umicore.com/recyclables/eScrap /Process/, accessed 2014-10-22.
  • 24. SZALATKIEWICZ J., SZEWCZYK R. BUDNY E., MISSALA T., WINIARSKI W. Measurement and Control System of the Plasmatron Plasma Reactor for Recovery of Metals from Printed Circuit Board Waste, Advances in Intelligent Systems and Computing volume 267, Springer, 2014.
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.agro-40bc518f-1370-43ca-aebe-97e1ffc4e651
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