DMDHEU resin as a potential adhesive for woody materials bonding

• Autorzy: Maminski M. , Barczak O. , Hua L. S. , Chen L. W. , Auriga R.
• Języki publikacji: EN

Abstrakty

EN

PL

Słowa kluczowe

EN

particle board; wood adhesive; urea resin; formaldehyde emission; elasticity modulus; rupture modulus; bending strength; thickness swelling

• Wydawca: -
• Czasopismo: Annals of Warsaw University of Life Sciences - SGGW. Forestry and Wood Technology
• Rocznik: 2013
• Tom: 81
• Opis fizyczny: p.143-148,fig.,ref.

Twórcy

autor

Maminski M.

• Faculty of Wood Technology, Warsaw University of Life Sciences - SGGW, Nowoursynowska 159/34 str., 02-787 Warsaw, Poland

autor

Barczak O.

• Faculty of Wood Technology, Warsaw University of Life Sciences - SGGW, Nowoursynowska 159/34 str., 02-787 Warsaw, Poland

autor

Hua L. S.

• Faculty of Forestry, University Putra Malaysia, 42400 UPM Serdang, Selangor, Malaysia

autor

Chen L. W.

• Faculty of Forestry, University Putra Malaysia, 42400 UPM Serdang, Selangor, Malaysia

autor

Auriga R.

• Faculty of Wood Technology, Warsaw University of Life Sciences - SGGW, Nowoursynowska 159/34 str., 02-787 Warsaw, Poland